Invention Application
- Patent Title: COVER RING AND GROUND SHIELD FOR PHYSICAL VAPOR DEPOSITION CHAMBER
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Application No.: US17214656Application Date: 2021-03-26
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Publication No.: US20220310362A1Publication Date: 2022-09-29
- Inventor: Tsung-Cheng WU , Sheng-Ying WU , Ming-Hsien LIN
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01J37/34 ; C23C14/35

Abstract:
A processing chamber includes a ground shield and a cover ring. The ground shield includes an annular body, and at least one guide pin extending from the annular body. The cover ring is positioned on the ground shield, and includes an annular body including at least one recess. At least a part of the at least one guide pin is receivable in the at least one recess, an inner cylindrical ring extends from the annular body, and an outer cylindrical ring extends from the annular body and is radially separated from the inner cylindrical ring by a horizontally extending portion of the annular body.
Public/Granted literature
- US11569071B2 Cover ring and ground shield for physical vapor deposition chamber Public/Granted day:2023-01-31
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