- 专利标题： MICROPHONE ASSEMBLY AND HEADLINING ASSEMBLY
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申请号： US17706236申请日： 2022-03-28
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公开(公告)号： US20220321985A1公开(公告)日： 2022-10-06
- 发明人: Shunji MURAOKA , Shushin NODA , Yoshifumi YAMANAKA , Kouta ONOYAMA , Daisuke KITAGUCHI , Jun MIYAJIMA
- 申请人： HOSIDEN CORPORATION
- 申请人地址： JP Osaka
- 专利权人： HOSIDEN CORPORATION
- 当前专利权人： HOSIDEN CORPORATION
- 当前专利权人地址： JP Osaka
- 优先权： JP2021-063334 20210402
- 主分类号： H04R1/04
- IPC分类号： H04R1/04 ; H04R1/08
摘要：
A microphone assembly comprises a circuit board, a microphone element connected to the circuit board, an external connection interface connected to the circuit board, and hot melt that is formed to cover the circuit board, the microphone element, and the external connection interface and has a hole formed to expose a part of the back side of the circuit board or the sound receiving part of the microphone element.
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