发明申请
- 专利标题: TRAY
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申请号: US17690121申请日: 2022-03-09
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公开(公告)号: US20220328334A1公开(公告)日: 2022-10-13
- 发明人: Hsu-Chi Lee , Pi-Yu Peng , Chun-Te Lee
- 申请人: CHIPBOND TECHNOLOGY CORPORATION
- 申请人地址: TW Hsinchu
- 专利权人: CHIPBOND TECHNOLOGY CORPORATION
- 当前专利权人: CHIPBOND TECHNOLOGY CORPORATION
- 当前专利权人地址: TW Hsinchu
- 优先权: TW110113072 20210412
- 主分类号: H01L21/673
- IPC分类号: H01L21/673
摘要:
A tray includes a body for placement of a component (e.g. electronic component) and a taker disposed on a bottom surface of the body. The taker is used to take a spacer and includes a first taking element and a second taking element. The first taking element includes a first connection portion and a first confinement portion, and the second taking element includes a second connection portion and a second confinement portion. An accommodation space is provided between the first and second connection portions and a passageway is provided between the first and second confinement portions. While the spacer is moved through the passageway and into the accommodation space, it is confined in the accommodation space by the first and second confinement portions such that the taker can take away the spacer to show another tray located under the spacer as the tray is removed.
公开/授权文献
- US11764090B2 Tray 公开/授权日:2023-09-19
信息查询
IPC分类: