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公开(公告)号：US20230044473A1
公开(公告)日：2023-02-09
申请号：US17837145
申请日：2022-06-10
发明人： Yin-Chen Lin , Hui-Yu Huang , Chih-Ming Peng , Chun-Te Lee
摘要： A double-sided flexible circuit board includes a flexible substrate, a first circuit layer, a second circuit layer, an insulating protection layer and a plurality of through circuit lines. The first and second circuit layers are located on a top surface and a bottom surface of the flexible substrate, respectively. The insulating protection layer covers a supporting line of the second circuit layer such that the supporting line is located between the flexible substrate and the insulating protection layer. The insulating protection layer can provide electrical insulation to the supporting line of the second circuit layer to avoid short circuit conditions of the double-sided flexible circuit board during test.
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公开(公告)号：US20220328334A1
公开(公告)日：2022-10-13
申请号：US17690121
申请日：2022-03-09
发明人： Hsu-Chi Lee , Pi-Yu Peng , Chun-Te Lee
IPC分类号： H01L21/673
摘要： A tray includes a body for placement of a component (e.g. electronic component) and a taker disposed on a bottom surface of the body. The taker is used to take a spacer and includes a first taking element and a second taking element. The first taking element includes a first connection portion and a first confinement portion, and the second taking element includes a second connection portion and a second confinement portion. An accommodation space is provided between the first and second connection portions and a passageway is provided between the first and second confinement portions. While the spacer is moved through the passageway and into the accommodation space, it is confined in the accommodation space by the first and second confinement portions such that the taker can take away the spacer to show another tray located under the spacer as the tray is removed.
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公开(公告)号：US20210267047A1
公开(公告)日：2021-08-26
申请号：US17032244
申请日：2020-09-25
发明人： Chia-En Fan , Hui-Yu Huang , Chih-Ming Peng , Chun-Te Lee
摘要： A circuit board disclosed in the present invention includes a substrate and a circuit layer. The circuit layer is formed on a surface of the substrate and includes at least one test circuit line. The test circuit line includes a main segment and a branch segment connected with each other. The branch segment is provided to be contacted with a test equipment for electrical test so as to protect the main segment from breaking during electrical test.
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公开(公告)号：US11177206B2
公开(公告)日：2021-11-16
申请号：US16833826
申请日：2020-03-30
发明人： Chun-Te Lee , Chih-Ming Peng , Hui-Yu Huang , Yin-Chen Lin
IPC分类号： H01L23/498 , H01L23/00
摘要： A layout structure of double-sided flexible circuit board includes a flexible substrate having a first surface and a second surface, a first circuit layer and a second circuit layer. An inner bonding region is defined on the first surface and an inner supporting region is defined on the second surface according to the inner bonding region. The first circuit layer is located on the first surface and includes first conductive lines which each includes an inner lead located on the inner bonding region. The second circuit layer is located on the second surface and includes second conductive lines which each includes an inner supporting segment located on the inner supporting region. A width difference between any two of the inner supporting segment of the second conductive lines is less than 8 μm.
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公开(公告)号：US20210267049A1
公开(公告)日：2021-08-26
申请号：US17160483
申请日：2021-01-28
发明人： Yin-Chen Lin , Hui-Yu Huang , Chih-Ming Peng , Chun-Te Lee
IPC分类号： H05K1/02
摘要： A flexible circuit board includes a flexible light-permeable carrier, a circuit layer, a mark and a stiffener. The circuit layer and the mark are located on a top surface of the flexible light-permeable carrier. A predetermined area and a stiffener mounting area corresponding to each other are defined on the top surface and a bottom surface of the flexible light-permeable carrier, respectively. The mark is opaque to create a shadow mark having a longitudinal reference side and a lateral reference side on the bottom surface. The stiffener is adhered to the stiffener mounting area defined on the bottom surface by aligning with the longitudinal reference side and the lateral reference side of the shadow mark.
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公开(公告)号：US20230380053A1
公开(公告)日：2023-11-23
申请号：US18134082
申请日：2023-04-13
发明人： Chun-Te Lee , Chih-Ming Peng , Pi-Yu Peng , Hui-Yu Huang
CPC分类号： H05K1/0266 , H01L21/60 , H05K3/0044 , H05K1/03 , H01L2021/60022 , H05K2201/10893
摘要： A flip-chip bonding structure includes a chip and a circuit board, the chip is bonded to the circuit board by bumps. The circuit board includes a light-transmissive substrate, a first circuit group, a second circuit group, a boundary circuit and an identifying member. The boundary circuit is located between the first and second circuit groups and projects a boundary circuit shadow on light-transmissive substrate. The boundary circuit shadow can be recognized according to the identifying member and is provided to identify the boundary between the first and second circuit groups or identify the position of leads with the smallest pitch.
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公开(公告)号：US11792923B2
公开(公告)日：2023-10-17
申请号：US17470038
申请日：2021-09-09
发明人： Shih-Chieh Chang , Hui-Yu Huang , Chih-Ming Peng , Chun-Te Lee
CPC分类号： H05K1/0277 , H05K1/14 , H05K1/189 , H05K2201/09036
摘要： A storage device of the present invention is provided to store flexible circuit packages, each of the flexible circuit packages includes an electronic component and two circuit portions warped at both sides of the electronic component, respectively. The storage device includes a first carrier and a second carrier. The first carrier includes first accommodation elements provided for placement of the flexible circuit packages, and the second carrier includes a first press portion and a second press portion. As the second carrier is placed on the first carrier, the first and second press portions are provided to press the two circuit portions warped upwardly toward the second carrier so as to reduce the warpage of the two circuit portions.
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公开(公告)号：US20230326896A1
公开(公告)日：2023-10-12
申请号：US18108733
申请日：2023-02-13
发明人： Sheng-Jen Wu , Shih-Chung Chang , Hsueh-Shun Yeh , Chun-Te Lee
IPC分类号： H01L23/00
CPC分类号： H01L24/26 , H01L24/32 , H01L24/29 , H01L24/05 , H01L2224/26125 , H01L2224/04026 , H01L2224/05558 , H01L2224/05573 , H01L2224/05666 , H01L2224/05684 , H01L2924/0132 , H01L2224/05647 , H01L2224/05655 , H01L2224/05644 , H01L2224/05672 , H01L2224/29144 , H01L2224/29147 , H01L2224/29111 , H01L2224/29139 , H01L2224/29109 , H01L2224/29113 , H01L2224/29116 , H01L2224/29017 , H01L2224/29019 , H01L2224/29034 , H01L2224/32225
摘要： A COF package includes a substrate and a chip, composite bumps on the chip are bonded to leads on the substrate. Each of the composite bumps includes a raising strip, a UBM layer and a bonding layer. A bonding rib is formed on the bonding layer because of the raising strip and the UBM layer, and the bonding rib on each of the composite bumps can be inserted into each of the leads and surface-contact with each of the leads to increase weld length and bonding strength between the bonding layer and the leads and further reduce a force required for bonding the chip to the substrate in a flip-chip bonding process.
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公开(公告)号：US11764090B2
公开(公告)日：2023-09-19
申请号：US17690121
申请日：2022-03-09
发明人： Hsu-Chi Lee , Pi-Yu Peng , Chun-Te Lee
IPC分类号： H01L21/673
CPC分类号： H01L21/67333
摘要： A tray includes a body for placement of a component (e.g. electronic component) and a taker disposed on a bottom surface of the body. The taker is used to take a spacer and includes a first taking element and a second taking element. The first taking element includes a first connection portion and a first confinement portion, and the second taking element includes a second connection portion and a second confinement portion. An accommodation space is provided between the first and second connection portions and a passageway is provided between the first and second confinement portions. While the spacer is moved through the passageway and into the accommodation space, it is confined in the accommodation space by the first and second confinement portions such that the taker can take away the spacer to show another tray located under the spacer as the tray is removed.
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公开(公告)号：US20220087017A1
公开(公告)日：2022-03-17
申请号：US17380121
申请日：2021-07-20
发明人： Yin-Chen Lin , Ming-Hsiao Ke , Hui-Yu Huang , Chih-Ming Peng , Chun-Te Lee
摘要： A circuit board tape includes substrate units each including a sprocket-hole region, a layout region and a joining mark. There are odd and more than three sprocket holes on the sprocket-hole region. An imaginary line extended from the joining mark is extended to between a first layout and a second layout located on the layout region. The amount of the sprocket holes between the imaginary lines of the adjacent substrate units is odd. The circuit board tape is cut along the imaginary lines of the different substrate units so as to remove the defective substrate unit from the circuit board tape and divide the circuit board tape into a front tape and a rear tape. After joining the front and rear tapes, the region where a first layout on the front tape and a second layout on the rear tape are located is defined as a combined layout region.
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