Invention Application
- Patent Title: PHOTORESIST COMPOSITION AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE
-
Application No.: US17721852Application Date: 2022-04-15
-
Publication No.: US20220334474A1Publication Date: 2022-10-20
- Inventor: Hongjoon LEE , Sungan DO , Sukkoo HONG , Seongji KWON , Jonghoon KIM , Sooyoung KIM , Jaehee CHOI
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2021-0050090 20210416,KR10-2022-0005333 20220113
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/038
Abstract:
A photoresist composition and a method of fabricating a semiconductor device, the composition including a photosensitive polymer having a protecting group; a photoacid generator (PAG); a metal precursor, the metal precursor being capable of generating metal ions and secondary electrons in response to irradiating light of a 13.5 nm wavelength thereto; and a solvent.
Information query
IPC分类:
