The present disclosure provides a conductive material, a method for manufacturing the conductive material and an electronic device, and relates to the technical field of new materials. The conductive material provided by the present disclosure includes: a first component and a second component. The first component includes a liquid metal having a melting point below room temperature, a coating material, and a first solvent. The coating material coats liquid metal droplets formed by the liquid metal. The second component includes a base resin and a conductive powder. The first component and the second component are weighed in proportion, and are uniformly mixed to obtain the conductive material. The technical solution of the present disclosure can obtain a wire having better flexibility.