Invention Application
- Patent Title: METHODS FOR LOW RESISTIVITY AND STRESS TUNGSTEN GAP FILL
-
Application No.: US17857341Application Date: 2022-07-05
-
Publication No.: US20220336274A1Publication Date: 2022-10-20
- Inventor: Xi CEN , Kai WU , Min HEON , Wei Min CHAN , Tom Ho Wing YU , Peiqi WANG , Ju Ik KANG , Feihu WANG , Nobuyuki SASAKI , Chunming ZHOU
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L21/02 ; C23C16/04

Abstract:
Method for forming tungsten gap fill on a structure, including high aspect ratio structures includes depositing a tungsten liner in the structure using a physical vapor deposition (PVD) process with high ionization and an ambient gas of argon or krypton. The PVD process is performed at a temperature of approximately 20 degrees Celsius to approximately 300 degrees Celsius. The method further includes treating the structure with a nitridation process and depositing bulk fill tungsten into the structure using a chemical vapor deposition (CVD) process to form a seam suppressed boron free tungsten fill. The CVD process is performed at a temperature of approximately 300 degrees Celsius to approximately 500 degrees Celsius and at a pressure of approximately 5 Torr to approximately 300 Torr.
Public/Granted literature
- US12094773B2 Methods for low resistivity and stress tungsten gap fill Public/Granted day:2024-09-17
Information query
IPC分类: