Invention Application
- Patent Title: SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Application No.: US17233287Application Date: 2021-04-16
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Publication No.: US20220336317A1Publication Date: 2022-10-20
- Inventor: Chang-Lin YEH
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/42 ; H01L21/56
Abstract:
A semiconductor device package and a method for manufacturing the semiconductor device package are provided. The semiconductor device package includes a first substrate with a aperture, a second substrate disposed on the first substrate, a first electronic component disposed on the second substrate, an encapsulant disposed on the first substrate and covering the second substrate and a first heat dissipation structure extending through the aperture and attached to the second substrate.
Information query
IPC分类:
