公开(公告)号：US20230245963A1

公开(公告)日：2023-08-03

申请号：US18133463

申请日：2023-04-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin YEH

IPC: H01L23/498 ,  H01L21/48 ,  H01L25/16

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L25/16 ,  H01L23/49822

Abstract: A semiconductor device package includes a first substrate, a second substrate, a conductive structure, a first solder and a second solder. The second substrate is disposed over the first substrate. The conductive structure is disposed between the first substrate and the second substrate. The conductive structure includes a first wetting portion, a second wetting portion, and a non-wetting portion disposed between the first wetting portion and the second wetting portion. The first solder covers the first wetting portion and connects the conductive structure to the first substrate. The second solder covers the second wetting portion and connects the conductive structure to the second substrate. The first solder is spaced apart from the second solder by the non-wetting portion.

公开(公告)号：US20230042984A1

公开(公告)日：2023-02-09

申请号：US17396605

申请日：2021-08-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin YEH

IPC: A61B5/00 ,  H05K5/06 ,  H05K5/00

Abstract: A wearable device is provided. The wearable device includes an electronic component and an encapsulant. The encapsulant includes a low-penetrability region encapsulating the electronic component and a high-penetrability region physically separated from the electronic component.

公开(公告)号：US20230005970A1

公开(公告)日：2023-01-05

申请号：US17903922

申请日：2022-09-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung CHEN ,  Yung I YEH ,  Chang-Lin YEH ,  Sheng-Yu CHEN

IPC: H01L27/12 ,  H01L33/54 ,  H01L25/075 ,  H01L33/62

Abstract: A semiconductor device package includes a main substrate, at least one thin film transistor (TFT) module, at least one first electronic component, at least one encapsulant and a plurality of light emitting devices. The main substrate has a first surface and a second surface opposite to the first surface. The thin film transistor (TFT) module is disposed adjacent to and electrically connected to the first surface of the main substrate. The first electronic component is disposed adjacent to and electrically connected to the first surface of the main substrate. The encapsulant covers the at least one thin film transistor (TFT) module and the at least one first electronic component. The light emitting devices are electrically connected to the at least one thin film transistor (TFT) module.

公开(公告)号：US20220384289A1

公开(公告)日：2022-12-01

申请号：US17884515

申请日：2022-08-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi CHEN ,  Chang-Lin YEH ,  Jen-Chieh KAO

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/66 ,  H01Q1/22 ,  H01L23/00 ,  H01Q19/10 ,  H01Q13/10 ,  H01L23/10 ,  H01Q21/06

Abstract: A semiconductor package device includes a first substrate, a second substrate and a first spacer. The first substrate includes a first divided pad. The second substrate includes a second divided pad disposed above the first divided pad. The first spacer is disposed between the first divided pad and the second divided pad. The first spacer is in contact with the first divided pad and the second divided pad.

公开(公告)号：US20190139786A1

公开(公告)日：2019-05-09

申请号：US15807266

申请日：2017-11-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin YEH

IPC: H01L21/56 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

Abstract: In one or more embodiments, a semiconductor package device includes a substrate, a trace, a structure, a barrier element and an underfill. The substrate has a first surface including a filling region surrounded by the trace. The structure is disposed over the filling region and electrically connected to the substrate. The barrier element is disposed on the trace. The underfill is disposed on the filling region.

公开(公告)号：US20220336317A1

公开(公告)日：2022-10-20

申请号：US17233287

申请日：2021-04-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin YEH

IPC: H01L23/367 ,  H01L23/42 ,  H01L21/56

Abstract: A semiconductor device package and a method for manufacturing the semiconductor device package are provided. The semiconductor device package includes a first substrate with a aperture, a second substrate disposed on the first substrate, a first electronic component disposed on the second substrate, an encapsulant disposed on the first substrate and covering the second substrate and a first heat dissipation structure extending through the aperture and attached to the second substrate.

公开(公告)号：US20220223489A1

公开(公告)日：2022-07-14

申请号：US17707803

申请日：2022-03-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Sheng-Yu CHEN ,  Chang-Lin YEH ,  Ming-Hung CHEN

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/29 ,  H01L23/538 ,  H01L25/065 ,  H01L21/56

Abstract: A semiconductor package includes a substrate having a first side and a second side opposite to the first side, a first type semiconductor die disposed on the first side of the substrate, a first compound attached to the first side and encapsulating the first type semiconductor die, and a second compound attached to the second side, causing a stress with respect to the first type semiconductor die in the first compound. A method for manufacturing the semiconductor package described herein is also disclosed.

公开(公告)号：US20220141971A1

公开(公告)日：2022-05-05

申请号：US17573595

申请日：2022-01-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung CHEN ,  Yung I. YEH ,  Chang-Lin YEH ,  Sheng-Yu CHEN

IPC: H05K5/00 ,  H05K5/06 ,  H05K1/18 ,  H05K9/00 ,  H05K3/28 ,  H05K1/14

Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.

公开(公告)号：US20210118760A1

公开(公告)日：2021-04-22

申请号：US16656338

申请日：2019-10-17

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin YEH

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/00

Abstract: A semiconductor device package comprises a carrier, a stop layer, a barrier layer and an encapsulant. The carrier has a first surface and a second surface recessed with respect to the first surface. The stop layer is disposed on the second surface of the carrier. The barrier layer is disposed on the stop layer and protruded from the first surface of the carrier. The encapsulant is disposed on the first surface of the carrier. Further, the encapsulant has a side surface disposed on the barrier layer.

公开(公告)号：US20210057572A1

公开(公告)日：2021-02-25

申请号：US16550110

申请日：2019-08-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung CHEN ,  Sheng-Yu CHEN ,  Chang-Lin YEH ,  Yung-I YEH

IPC: H01L29/786 ,  H01L27/32 ,  H01L27/11 ,  H01L51/52

Abstract: A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the first surface of the first substrate. The electronic module includes a second substrate and an electronic component. The second substrate has a first surface facing the second surface of the first substrate and a second surface opposite to the first surface. The electronic component is disposed on the second surface of the second substrate. The conductive adhesion layer is disposed between the first substrate and the second substrate.