Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
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Application No.: US17808533Application Date: 2022-06-23
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Publication No.: US20220336327A1Publication Date: 2022-10-20
- Inventor: EUNJI KIM , Sungdong CHO , Kwangwuk PARK , Sangjun PARK , Daesuk LEE , Hakseung LEE
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2019-0087761 20190719
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L25/18 ; H01L21/768
Abstract:
A semiconductor device includes a semiconductor substrate having an active surface on which semiconductor elements are provided. An interlayer insulating film is provided on the semiconductor substrate. A first via structure passes through the semiconductor substrate. The first via structure has a first diameter. A second via structure passes through the semiconductor substrate. The second via structure has a second diameter that is greater than the first diameter. The first via structure has a step portion that is in contact with the interlayer insulating film.
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