发明申请
- 专利标题： CONDUCTIVE STRUCTURE, PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
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申请号： US17233294申请日： 2021-04-16
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公开(公告)号： US20220336332A1公开(公告)日： 2022-10-20
- 发明人: You-Lung YEN , Bernd Karl APPELT
- 申请人： Advanced Semiconductor Engineering, Inc.
- 申请人地址： TW Kaohsiung
- 专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人： Advanced Semiconductor Engineering, Inc.
- 当前专利权人地址： TW Kaohsiung
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L23/31 ; H01L23/053 ; H01L21/48 ; H01L21/56
摘要：
A conductive structure, a package structure and a method for manufacturing the same are provided. The conductive structure includes a main portion, a first electrical contact, a second electrical contact, a first post and a second post. The main portion has a first surface and a second surface opposite to the first surface. The first electrical contact is disposed adjacent to the first surface of the main portion. The second electrical contact is disposed adjacent to the second surface of the main portion and electrically connected to the first electrical contact. The first post is electrically connected to the first electrical contact. The second post is electrically connected to the second electrical contact.
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