- 专利标题： THREE DIMENSIONAL INTEGRATED CIRCUIT WITH MONOLITHIC INTER-TIER VIAS (MIV)
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申请号： US17237443申请日： 2021-04-22
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公开(公告)号： US20220344258A1公开(公告)日： 2022-10-27
- 发明人: Shih-Wei Peng , Jiann-Tyng Tzeng , Kam-Tou Sio , Wei-Cheng Lin , Wei-An Lai
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsinchu
- 主分类号： H01L23/522
- IPC分类号： H01L23/522 ; H01L27/06 ; H01L23/528 ; H01L27/02
摘要：
A monolithic three-dimensional (3D) integrated circuit (IC) device includes a lower tier including a lower tier cell and an upper tier arranged over the lower tier. The upper tier has a first upper tier cell and a second upper tier cell separated by a predetermined lateral space. A monolithic inter-tier via (MIV) extends from the lower tier through the predetermined lateral space, and the MIV has a first end electrically connected to the lower tier cell and a second end electrically connected to the first upper tier cell.
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