Invention Application
- Patent Title: MULTI-USE TRANSFER MOLD AND METHOD OF MANUFACTURING DISPLAY APPARATUS
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Application No.: US17550851Application Date: 2021-12-14
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Publication No.: US20220344533A1Publication Date: 2022-10-27
- Inventor: Junsik HWANG , Kyungwook HWANG , Dongho KIM , Hyunjoon KIM , Joonyong PARK , Seogwoo HONG
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2021-0082328 20210624
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
A multi-use transfer mold and a method of manufacturing a display apparatus are provided. The multi-use transfer mold includes a transfer substrate and a plurality of grooves provided in the transfer substrate, wherein each of the grooves includes a transfer area for accommodating a transfer micro-light-emitting device and a preliminary area for accommodating a preliminary micro-light-emitting device, wherein the preliminary area is connected to the transfer area.
Information query
IPC分类: