Invention Application
- Patent Title: ULTRA-HIGH MODULUS AND RESPONSE PVDF THIN FILMS
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Application No.: US17582574Application Date: 2022-01-24
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Publication No.: US20220348730A1Publication Date: 2022-11-03
- Inventor: Sheng Ye , Arman Boromand , Christopher Yuan Ting Liao , Laura Cressman , Emma Rae Mullen , Andrew John Ouderkirk , Hao Mei , Cody Wayne Weyhrich , Rui Jian
- Applicant: META PLATFORMS TECHNOLOGIES, LLC
- Applicant Address: US CA Menlo Park
- Assignee: META PLATFORMS TECHNOLOGIES, LLC
- Current Assignee: META PLATFORMS TECHNOLOGIES, LLC
- Current Assignee Address: US CA Menlo Park
- Main IPC: C08J5/18
- IPC: C08J5/18 ; H01L41/193 ; H01L41/333 ; H01L41/08

Abstract:
A polymer thin film includes polyvinylidene fluoride (PVDF) and is characterized by a Young's modulus along an in-plane dimension of at least 4 GPa, an electromechanical coupling factor (k31) of at least 0.1 at room temperature. A method of manufacturing such a polymer thin film may include forming a polymer composition into a polymer thin film, applying a tensile stress to the polymer thin film along at least one in-plane direction and in an amount effective to induce a stretch ratio of at least approximately 5 in the polymer thin film, and applying an electric field across a thickness dimension of the polymer thin film. Annealing and poling steps may separately or simultaneously accompany and/or follow the act of stretching of the polymer thin film.
Information query