An RF heat dissipation plastic including a polymer matrix comprising a polymer resin; and a first filler that is dispersed in the polymer matrix, and includes a high-strength filler, which is a polymer containing at least one hydroxy group in the repeating unit thereof, and an inorganic coating layer formed on at least a part of the surface of the high-strength filler. Therefore, the RF heat dissipation plastic has a low dielectric constant and excellent mechanical strength are simultaneously exhibited.