Invention Application
- Patent Title: WORKING STATE DETERMINATION OF ELECTRONIC COMPONENTS
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Application No.: US17298564Application Date: 2019-05-29
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Publication No.: US20220349958A1Publication Date: 2022-11-03
- Inventor: Chih-Hung Chien , Shih Huang Wu , Po Chao Chen
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- International Application: PCT/US2019/034261 WO 20190529
- Main IPC: G01R31/68
- IPC: G01R31/68

Abstract:
Techniques for determining a working state of an electronic component of an electronic device are described. The electronic component is coupled to the electronic device via a connection interface and a connector. The electronic device further comprises a contact detection assembly. The contact detection assembly detects a position of the connector relative to a connection interface. Based on the position of the connector relative to the connection interface, a state of connection between the connector and the connection interface is determined.
Information query
IPC分类: