Invention Application
- Patent Title: FREQUENCY- AND PROCESS-INSENSITIVE SPLITTING USE MULTIPLE SPLITTERS IN SERIES
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Application No.: US17392873Application Date: 2021-08-03
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Publication No.: US20220350178A1Publication Date: 2022-11-03
- Inventor: Min-Hsiang Hsu , Cheng-Tse Tang , Hau-Yan Lu , Yingkit Felix Tsui
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: G02F1/015
- IPC: G02F1/015 ; G02F1/025 ; G02F1/225

Abstract:
In some embodiments, the present disclosure relates to a device having a first waveguide and a second waveguide arranged over a substrate. The first waveguide has a first input terminal and a first output terminal, wherein the first input terminal is configured to receive light. The second waveguide is arranged laterally beside the first waveguide and has a second input terminal and a second output terminal. The second input terminal of the second waveguide is configured to receive light. The first waveguide further includes a first portion that has a different structure than surrounding portions of the first waveguide. The second waveguide further includes a second portion that has a different structure than surrounding portions of the second waveguide. The first waveguide is spaced apart at a maximum distance from the second waveguide at the first portion and the second portion.
Public/Granted literature
- US12140796B2 Frequency- and process-insensitive splitting use multiple splitters in series Public/Granted day:2024-11-12
Information query