Invention Application
- Patent Title: SEMICONDUCTOR DEVICE WITH EPITAXIAL CONTACT
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Application No.: US17861565Application Date: 2022-07-11
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Publication No.: US20220352164A1Publication Date: 2022-11-03
- Inventor: Kuo-Cheng CHING , Ching-Wei TSAI , Kuan-Lun CHENG , Chih-Hao WANG
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L29/66 ; H01L21/8238 ; H01L29/06 ; H01L29/78 ; H01L29/167 ; H01L29/08 ; H01L21/768 ; H01L21/285 ; H01L29/417

Abstract:
A semiconductor device includes a semiconductor fin, a gate structure, source/drain structures, and a contact structure. The semiconductor fin extends from a substrate. The gate structure extends across the semiconductor fin. The source/drain structures are on opposite sides of the gate structure. The contact structure is over a first one of the source/drain structures. The contact structure includes a semiconductor contact and a metal contact over the semiconductor contact. The semiconductor contact has a higher dopant concentration than the first one of the source/drain structures. The first one of the source/drain structures includes a first portion and a second portion at opposite sides of the fin and interfacing the semiconductor contact.
Public/Granted literature
Information query
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