Invention Application
- Patent Title: THREE-DIMENSIONAL MEMORY DEVICE WITH MULTIPLE TYPES OF SUPPORT PILLAR STRUCTURES AND METHOD OF FORMING THE SAME
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Application No.: US17244258Application Date: 2021-04-29
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Publication No.: US20220352196A1Publication Date: 2022-11-03
- Inventor: Kenichi SHIMOMURA , Koichi MATSUNO , Johann ALSMEIER
- Applicant: SANDISK TECHNOLOGIES LLC
- Applicant Address: US TX Addison
- Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee Address: US TX Addison
- Main IPC: H01L27/11582
- IPC: H01L27/11582 ; H01L27/11556 ; H01L27/11519 ; H01L27/11565 ; H01L27/1157 ; H01L27/11524

Abstract:
Two types of support pillar structures are formed in a staircase region of an alternating stack of insulating layers and sacrificial material layers. First-type support pillar structures are formed in areas distal from backside trenches to be subsequently formed, and second-type support pillar structures may be formed in areas proximal to the backside trenches. The second-type support pillar structures may be formed as dielectric support pillar structures, or may be formed with at least one additional dielectric spacer.
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