Invention Application
- Patent Title: SEMICONDUCTOR DEVICE
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Application No.: US17765046Application Date: 2020-10-05
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Publication No.: US20220352865A1Publication Date: 2022-11-03
- Inventor: Kazuaki OHSHIMA , Hitoshi KUNITAKE , Yuto YAKUBO , Takayuki IKEDA
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Priority: JP2019-190550 20191017
- International Application: PCT/IB2020/059313 WO 20201005
- Main IPC: H03H7/38
- IPC: H03H7/38 ; H01L21/822 ; H01L21/02 ; H03F3/60 ; H03F3/19 ; H01L27/088

Abstract:
An amplifier is formed in a wiring layer. A semiconductor device includes a second layer over a first layer with a metal oxide therebetween. The first layer includes a first transistor including a first semiconductor layer containing silicon. The second layer includes an impedance matching circuit, and the impedance matching circuit includes a second transistor including a second semiconductor layer containing gallium. The first transistor forms first coupling capacitance between the first transistor and the metal oxide, and the impedance matching circuit forms second coupling capacitance between the impedance matching circuit and the metal oxide. The impedance matching circuit is electrically connected to the metal oxide through the second coupling capacitance. The metal oxide inhibits the influence of first radiation noise emitted from the impedance matching circuit on the operation of the first transistor.
Public/Granted literature
- US12095440B2 Semiconductor device Public/Granted day:2024-09-17
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