Invention Application
- Patent Title: METAL-CLAD LAMINATE AND PRINTED WIRING BOARD
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Application No.: US17621011Application Date: 2020-06-19
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Publication No.: US20220353988A1Publication Date: 2022-11-03
- Inventor: Dai SASAKI , Yasunori NISHIGUCHI , Kazuki MATSUMURA , Yohsuke ISHIKAWA , Hiroki TAMIYA , Koji KISHINO
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Priority: JP2019-119108 20190626
- International Application: PCT/JP2020/024182 WO 20200619
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/05

Abstract:
A metal-clad laminate includes: an insulating layer; and a metal layer stacked on the insulating layer. The insulating layer includes: a first layer; and a second layer interposed between the first layer and the metal layer. The first layer contains a cured product of a first resin composition containing composite particles. The second layer contains a cured product of a second resin composition. The first resin composition contains composite particles, each having a core containing a fluororesin and a shell containing a silicon oxide that coats the core at least partially. The second resin composition may or may not contain composite particles. When the second resin composition contains the composite particles, a ratio of the composite particles in the second resin composition to solid content of the second resin composition is lower than a ratio of the composite particles in the first resin composition to solid content of the first resin composition.
Public/Granted literature
- US11638349B2 Metal-clad laminate and printed wiring board Public/Granted day:2023-04-25
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