Invention Application
- Patent Title: LEAD-FREE SOLDER MATERIAL, LAYER STRUCTURE, METHOD OF FORMING A SOLDER MATERIAL, AND METHOD OF FORMING A LAYER STRUCTURE
-
Application No.: US17713857Application Date: 2022-04-05
-
Publication No.: US20220355422A1Publication Date: 2022-11-10
- Inventor: Alexander ROTH , Catharina WILLE , Alexander HEINRICH
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Priority: DE102021110298.7 20210422
- Main IPC: B23K35/36
- IPC: B23K35/36 ; B32B15/01 ; B23K35/02 ; B23K1/00
Abstract:
A lead-free solder material is provided. In one example, the solder material may include solder particles including at least 30 wt % nickel, and an activator including or consisting of at least one of a group of activator materials, the group including an organic acid or salt thereof, and an amine or salt thereof.
Information query
IPC分类:
