Invention Application
- Patent Title: GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DUAL NANORIBBON CHANNEL STRUCTURES
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Application No.: US17870401Application Date: 2022-07-21
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Publication No.: US20220359697A1Publication Date: 2022-11-10
- Inventor: Tanuj TRIVEDI , Rahul RAMASWAMY , Jeong Dong KIM , Babak FALLAHAZAD , Hsu-Yu CHANG , Ting CHANG , Nidhi NIDHI , Walid M. HAFEZ
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/06 ; H01L29/66 ; H01L21/02 ; H01L29/10 ; H01L29/165

Abstract:
Gate-all-around integrated circuit structures having dual nanowire/nanoribbon channel structures, and methods of fabricating gate-all-around integrated circuit structures having dual nanowire/nanoribbon channel structures, are described. For example, an integrated circuit structure includes a first vertical arrangement of nanowires above a substrate. A dielectric cap is over the first vertical arrangement of nanowires. A second vertical arrangement of nanowires is above the substrate. Individual ones of the second vertical arrangement of nanowires are laterally staggered with individual ones of the first vertical arrangement of nanowires and the dielectric cap.
Public/Granted literature
- US11862703B2 Gate-all-around integrated circuit structures having dual nanoribbon channel structures Public/Granted day:2024-01-02
Information query
IPC分类: