Invention Application
- Patent Title: TRANSDERMAL MICRONEEDLE ARRAY PATCH
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Application No.: US17665269Application Date: 2022-02-04
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Publication No.: US20220361777A1Publication Date: 2022-11-17
- Inventor: Jung-Tang Huang , Kuan-Ting Lee , Dahong Qian
- Applicant: RichHealth Technology Corporation , Richtek Technology Corporation
- Applicant Address: TW Zhubei City; TW Chupei City
- Assignee: RichHealth Technology Corporation,Richtek Technology Corporation
- Current Assignee: RichHealth Technology Corporation,Richtek Technology Corporation
- Current Assignee Address: TW Zhubei City; TW Chupei City
- Priority: TW107107686 20180307
- Main IPC: A61B5/145
- IPC: A61B5/145 ; A61B5/15 ; A61B5/1486 ; A61B5/00

Abstract:
Provided is a transdermal microneedle array patch, including: a bottom cover; a top cover; a substrate disposed within the top cover; and a first probe and a second probe disposed between the bottom cover and the top cover and electrically connected the substrate. The first and second probes form an open circuit. While the bottom cover is combined with the top cover to form the transdermal microneedle array patch, the first and second probes form a closed circuit.
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