Invention Application
- Patent Title: POLISHING PADS HAVING IMPROVED PORE STRUCTURE
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Application No.: US17321694Application Date: 2021-05-17
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Publication No.: US20220362904A1Publication Date: 2022-11-17
- Inventor: Sivapackia GANAPATHIAPPAN , Uma SRIDHAR , Yingdong LUO , Ashwin CHOCKALINGAM , Mayu YAMAMURA , Sebastian David ROZO , Daniel REDFIELD , Rajeev BAJAJ , Nag B. PATIBANDLA , Hou T. NG , Sudhakar MADHUSOODHANAN
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: B24B37/24
- IPC: B24B37/24

Abstract:
Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A method of forming a polishing pad includes (a) dispensing droplets of a pre-polymer composition and droplets of a sacrificial material composition onto a surface of a previously formed print layer according to a predetermined droplet dispense pattern. The method includes (b) at least partially curing the dispensed droplets of the pre-polymer composition to form a print layer. The method includes (c) sequentially repeating (a) and (b) to form a polishing layer having a plurality of pore-features formed therein. The pre-polymer composition includes a multifunctional acrylate component. A curing rate of the dispensed droplets of the pre-polymer composition including the multifunctional acrylate component when exposed to a first dose of electromagnetic radiation is greater than a curing rate of the pre-polymer composition without the multifunctional acrylate component when exposed to the same first dose of electromagnetic radiation.
Information query