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公开(公告)号：US20230019456A1
公开(公告)日：2023-01-19
申请号：US17945885
申请日：2022-09-15
Applicant: Applied Materials, Inc.
Inventor： Rajeev BAJAJ
IPC: A46D3/00 , A46B1/00 , A46B11/00 , A46B13/00 , B33Y80/00 , B29C64/112 , B29C64/124 , B24B37/34 , B33Y10/00
Abstract: Embodiments described herein generally relate to a brush, a method of forming a brush, and a structure embodied in a machine readable medium used in a design process are provided. The brush includes a body and a channel configured to deliver a cleaning liquid through holes in the body. The method forms the brush using 3D printing. The structure provides details for making the brush. The disclosure herein allows a method of forming a brush that does not require the removal of active porogen.
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公开(公告)号：US20210394333A1
公开(公告)日：2021-12-23
申请号：US16906992
申请日：2020-06-19
Applicant: Applied Materials, Inc.
Inventor： Puneet Narendra JAWALI , Nandan BARADANAHALLI KENCHAPPA , Jason G. FUNG , Shiyan Akalanka Jayanath WEWALA GONNAGAHADENIYAGE , Rajeev BAJAJ , Adam Wade MANZONIE , Andrew Scott LAWING
Abstract: Embodiments herein generally relate to polishing pads and method of forming polishing pads. In one embodiment, a polishing pad having a polishing surface that is configured to polish a surface of a substrate is provided. The polishing pad includes a polishing layer. At least a portion of the polishing layer comprises a continuous phase of polishing material featuring a plurality of first regions having a first pore-feature density and a plurality of second regions having a second pore-feature density that is different from the first pore-feature density. The plurality of first regions are distributed in a pattern in an X-Y plane of the polishing pad in a side-by-side arrangement with the plurality of second regions and individual portions or ones of the plurality of first regions are interposed between individual portions or ones of the plurality of second regions.
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公开(公告)号：US20210107116A1
公开(公告)日：2021-04-15
申请号：US17114633
申请日：2020-12-08
Applicant: Applied Materials, Inc.
Inventor： Rajeev BAJAJ , Daniel REDFIELD , Mahendra C. ORILALL , Boyi FU , Aniruddh Jagdish KHANNA , Jason G. FUNG , Ashwin CHOCKALINGAM , Mayu YAMAMURA , Veera Raghava Reddy KAKIREDDY , Gregory E. MENK , Nag B. PATIBANDLA
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
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4.发明申请公开(公告)号：US20200147750A1
公开(公告)日：2020-05-14
申请号：US16746065
申请日：2020-01-17
Applicant: Applied Materials, Inc.
Inventor： Rajeev BAJAJ , Kasiraman KRISHNAN , Mahendra C. ORILALL , Daniel REDFIELD , Fred C. REDEKER , Nag B. PATIBANDLA , Gregory E. MENK , Jason G. FUNG , Russell Edward PERRY , Robert E. DAVENPORT
Abstract: Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.
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5.发明申请公开(公告)号：US20180043613A1
公开(公告)日：2018-02-15
申请号：US15722810
申请日：2017-10-02
Applicant: Applied Materials, Inc.
Inventor： Kasiraman KRISHNAN , Daniel REDFIELD , Russell Edward PERRY , Gregory E. MENK , Rajeev BAJAJ , Fred C. REDEKER , Nag B. PATIBANDLA , Mahendra C. ORILALL , Jason G. FUNG
IPC: B24B37/26 , B24B37/22 , B29L31/00 , B29K105/16
Abstract: A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20170203408A1
公开(公告)日：2017-07-20
申请号：US15287665
申请日：2016-10-06
Applicant: Applied Materials, Inc.
Inventor： Sivapackia GANAPATHIAPPAN , Boyi FU , Ashwin CHOCKALINGAM , Daniel REDFIELD , Rajeev BAJAJ , Mahendra C. ORILALL , Hou T. NG , Jason G. FUNG , Mayu YAMAMURA
IPC: B24B37/24
CPC classification number: B24B37/24
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.
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公开(公告)号：US20140295742A1
公开(公告)日：2014-10-02
申请号：US14301910
申请日：2014-06-11
Applicant: APPLIED MATERIALS, INC.
Inventor： Rajeev BAJAJ
IPC: B24B53/017
CPC classification number: B24B53/017 , B23K26/3576 , B24B53/095
Abstract: A CMP system has a polishing table for supporting a CMP pad which a semiconductor wafer is polished. The CMP system has a laser source configured to regenerate the CMP pad through a conditioning process while the CMP pad is disposed on the polishing table.
Abstract translation: CMP系统具有用于支撑抛光半导体晶片的CMP焊盘的抛光台。 CMP系统具有被配置为通过调节过程再生CMP垫的激光源，同时将CMP垫设置在抛光台上。
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公开(公告)号：US20240025010A1
公开(公告)日：2024-01-25
申请号：US18480060
申请日：2023-10-03
Applicant: Applied Materials, Inc.
Inventor： Puneet Narendra JAWALI , Nandan BARADANAHALLI KENCHAPPA , Jason G. FUNG , Shiyan Akalanka Jayanath WEWALA GONNAGAHADENIYAGE , Rajeev BAJAJ , Adam Wade MANZONIE , Andrew Scott LAWING
Abstract: Embodiments herein generally relate to polishing pads and method of forming polishing pads. In one embodiment, a polishing pad having a polishing surface that is configured to polish a surface of a substrate is provided. The polishing pad includes a polishing layer. At least a portion of the polishing layer comprises a continuous phase of polishing material featuring a plurality of first regions having a first pore-feature density and a plurality of second regions having a second pore-feature density that is different from the first pore-feature density. The plurality of first regions are distributed in a pattern in an X-Y plane of the polishing pad in a side-by-side arrangement with the plurality of second regions and individual portions or ones of the plurality of first regions are interposed between individual portions or ones of the plurality of second regions.
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公开(公告)号：US20240025009A1
公开(公告)日：2024-01-25
申请号：US18377073
申请日：2023-10-05
Applicant: Applied Materials, Inc.
Inventor： Aniruddh Jagdish KHANNA , Jason G. FUNG , Puneet Narendra JAWALI , Rajeev BAJAJ , Adam Wade MANZONIE , Nandan BARADANAHALLI KENCHAPPA , Veera Raghava Reddy KAKIREDDY , Joonho AN , Jaeseok KIM , Mayu YAMAMURA
CPC classification number: B24B37/20 , B24B37/042
Abstract: Polishing pads having discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material are provided herein. In one embodiment a polishing pad features a plurality of polishing elements each comprising a polishing surface and sidewalls extending downwardly from the polishing surface to define a plurality of channels disposed between the polishing elements, wherein one or more of the polishing elements is formed of a continuous phase of polymer material having one or more first regions comprising a first porosity and a second region comprising a second porosity, wherein the second porosity is less than the first porosity.
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公开(公告)号：US20230294239A1
公开(公告)日：2023-09-21
申请号：US18202013
申请日：2023-05-25
Applicant: Applied Materials, Inc.
Inventor： Sivapackia GANAPATHIAPPAN , Ankit VORA , Boyi FU , Venkat HARIHARAN , Mayu YAMAMURA , Mario CORNEJO , Igor ABRAMSON , Mo YANG , Daniel REDFIELD , Rajeev BAJAJ , Nag B. PATIBANDLA
IPC: B24B37/24 , C08F283/00 , B33Y10/00 , B29C64/112 , B33Y70/10
CPC classification number: B24B37/24 , C08F283/008 , B33Y10/00 , B29C64/112 , B33Y70/10 , B29L2031/736
Abstract: Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer. The resin precursor formulation further comprises a photoinitiator, wherein the precursor formulation has a viscosity that enables the precursor formulation to be dispensed to form a portion of a polishing article by an additive manufacturing process.
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