Invention Application
- Patent Title: SYSTEMS AND METHODS FOR WAFER BOND MONITORING
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Application No.: US17878428Application Date: 2022-08-01
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Publication No.: US20220365001A1Publication Date: 2022-11-17
- Inventor: Chih-Yu WANG , Hsi-Cheng HSU
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: G01N21/95
- IPC: G01N21/95 ; H01L21/50 ; H01L21/66
Abstract:
Systems and methods are provided for monitoring wafer bonding and for detecting or determining defects in a wafer bond formed between two semiconductor wafers. A wafer bonding system includes a camera configured to monitor bonding between two semiconductor wafers. Wafer bonding defect detection circuitry receives video data from the camera, and detects a bonding defect based on the received video data.
Public/Granted literature
- US11815471B2 Systems and methods for wafer bond monitoring Public/Granted day:2023-11-14
Information query
