Invention Application
- Patent Title: IMAGE SENSOR DEVICE
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Application No.: US17876878Application Date: 2022-07-29
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Publication No.: US20220367549A1Publication Date: 2022-11-17
- Inventor: Feng-Chien HSIEH , Yun-Wei CHENG , Wei-Li HU , Kuo-Cheng LEE , Ying-Hao CHEN
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
An image sensor device includes a substrate, photosensitive pixels, an interconnect structure, a dielectric layer, and a light blocking element. The photosensitive pixels are in the substrate. The interconnect structure is over a first side of the substrate. The dielectric layer is over a second side of the substrate opposite the first side of the substrate. The light blocking element has a first portion extending over a top surface of the dielectric layer and a second portion extending in the dielectric layer. The second portion of the light blocking element laterally surrounds the photosensitive pixels.
Information query
IPC分类: