Invention Application
- Patent Title: UV- AND HEAT-CURABLE LADDER-LIKE POLYSILSESQUIOXANE COPOLYMER, INSULATION COMPOSITION CONTAINING SAME AND METHOD FOR FORMING MICROCIRCUIT PATTERN USING SAME
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Application No.: US17384200Application Date: 2021-07-23
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Publication No.: US20220372231A1Publication Date: 2022-11-24
- Inventor: Seung Sang HWANG , Soon Man Hong , Kyung Youl Baek , Chong Min Koo , Albert Lee , Seon Joon Kim , You Mee Choi
- Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
- Applicant Address: KR Seoul
- Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
- Current Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
- Current Assignee Address: KR Seoul
- Priority: KR10-2021-0058994 20210507
- Main IPC: C08G77/04
- IPC: C08G77/04 ; C08G77/28 ; G03F7/075 ; H01B3/30
Abstract:
The present disclosure relates to a UV- and heat-curable ladder-like polysilsesquioxane copolymer and a method for preparing the same. Since a controlled functionality can be provided only on a desired region via a thiol-ene click reaction without an additional additive, an insulating layer having a low dielectric constant and a microcircuit pattern can be formed without an additional etching process.
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