Invention Application
- Patent Title: Catalyst Enhanced Molybdenum Deposition And Gap Fill
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Application No.: US17327118Application Date: 2021-05-21
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Publication No.: US20220372617A1Publication Date: 2022-11-24
- Inventor: Xi Cen , Kai Wu , Seshadri Ganguli , Xinming Zhang , Norman L. Tam , Abhilash Mayur
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: C23C16/14
- IPC: C23C16/14

Abstract:
Methods of depositing a metal film are discussed. A metal film is formed on the bottom of feature having a metal bottom and dielectric sidewalls. Formation of the metal film comprises exposure to a metal precursor and an alkyl halide catalyst while the substrate is maintained at a deposition temperature. The metal precursor has a decomposition temperature above the deposition temperature. The alkyl halide comprises carbon and halogen, and the halogen comprises bromine or iodine.
Public/Granted literature
- US11859277B2 Catalyst enhanced molybdenum deposition and gap fill Public/Granted day:2024-01-02
Information query
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