Invention Application
- Patent Title: SEMICONDUCTOR DEVICE
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Application No.: US17717724Application Date: 2022-04-11
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Publication No.: US20220376040A1Publication Date: 2022-11-24
- Inventor: Makoto KOSHIMIZU , Yasutaka NAKASHIBA
- Applicant: RENESAS ELECTRONICS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2021-085964 20210521
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/78

Abstract:
A semiconductor device includes a semiconductor substrate, a gate dielectric film formed on the semiconductor substrate, a gate electrode formed on the gate dielectric film, a field plate portion which is integrally formed with the gate electrode, a step insulating film in contact with the field plate portion, a high dielectric constant film in contact with the step insulating film and having a higher dielectric constant than silicon.
Public/Granted literature
- US12015053B2 Semiconductor device Public/Granted day:2024-06-18
Information query
IPC分类: