The electronic component package body includes a substrate, an electronic component, and first pins. The substrate includes a bottom surface, a top surface, and a first side surface. The first side surface is connected between the bottom surface and the top surface. The electronic component is packaged inside the substrate. The first pins are embedded in the substrate, and penetrate from the bottom surface to the top surface. The first pins include a bottom surface and a side surface connected to the bottom surface. The bottom surface is exposed relative to the bottom surface, and at least a partial structure of the side surface is exposed relative to the first side surface. Both the bottom surface and the side surface are used for soldering with solder. Reliability of soldering the electronic component package body and a circuit board is high.