Invention Application
- Patent Title: INTEGRATED ELECTRONIC CIRCUIT INCLUDING A FIELD PLATE FOR THE LOCAL REDUCTION OF THE ELECTRIC FIELD AND RELATED MANUFACTURING PROCESS
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Application No.: US17824566Application Date: 2022-05-25
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Publication No.: US20220384585A1Publication Date: 2022-12-01
- Inventor: Elisabetta PIZZI , Dario RIPAMONTI , Matteo PATELMO , Fabrizio Fausto Renzo TOIA , Simone Dario MARIANI
- Applicant: STMicroelectronics S.r.l.
- Applicant Address: IT Agrate Brianza (MB)
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza (MB)
- Priority: IT102021000014180 20210531
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L29/06 ; H01L29/43 ; H01L49/02
Abstract:
An integrated electronic circuit including: a dielectric body delimited by a front surface; A top conductive region of an integrated electronic circuit extend within a dielectric body having a front surface. A passivation structure including a bottom portion and a top portion laterally delimits an opening. The bottom portion extends on the front surface, and the top portion extends on the bottom portion. A field plate includes an internal portion and an external portion. The internal portion is located within the opening and extends on the top portion of the passivation structure. The external portion extends laterally with respect to the top portion of the passivation structure and contacts at a bottom one of: the dielectric body or the bottom portion of the passivation structure. The opening and the external portion are arranged on opposite sides of the top portion of the passivation structure.
Information query
IPC分类:
