A high density coupling panel of the present disclosure presents a compact grouping of coupler wherein each of the couplers couples a first free connector with a second free connector wherein each of the free connectors is coupled to exactly two electrical conductors. The high density coupling panel can be manufactured in a shielded (e.g., metal) or non-shielded (e.g. non-metal) form as appropriate to a specific application. In the shielded configuration, a bonding strip is used to connect all metal components (e.g., shielded free connectors, shielded couplers, and metal panel of the high density coupling panel) to ground via a shielding tab.