Invention Application
- Patent Title: PRINTED CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE COMPRISING SAME
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Application No.: US17886327Application Date: 2022-08-11
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Publication No.: US20220386465A1Publication Date: 2022-12-01
- Inventor: Gyeongmin JIN , Jichul KIM , Yongjae SONG , Jaeyeon RA , Chagyu SONG
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2020-0016129 20200211
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K1/02

Abstract:
Disclosed is a printed circuit board assembly comprising: a first printed circuit board; a second printed circuit board stacked with the first printed circuit board; and an interposer arranged between the first printed circuit board and the second printed circuit board, wherein the second printed circuit board includes a first part and a second part extending in a first direction from a part of the first part and wherein a length of the second part in a second direction perpendicular to the first direction is less than a length in the second direction of the first part, and wherein the direction of a first conductive pattern formed on the first part and the direction of a second conductive pattern formed on the second part are substantially perpendicular to each other.
Public/Granted literature
- US12279371B2 Printed circuit board assembly and electronic device comprising same Public/Granted day:2025-04-15
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