ELECTRONIC DEVICE INCLUDING SUBSTRATE INCLUDING COATING LAYER

    公开(公告)号:US20250063676A1

    公开(公告)日:2025-02-20

    申请号:US18937936

    申请日:2024-11-05

    Abstract: An electronic device comprises: a first housing; a second housing; a hinge structure comprising a hinge rotatably connecting the first housing with the second housing; and a substrate including a flexible portion, a rigid portion, and a stepped portion arranged at a boundary between the flexible portion and the rigid portion. The substrate comprises: a first conductive layer arranged in the flexible portion and the rigid portion; a first coating layer arranged on a portion of the first conductive layer corresponding to the rigid portion; a second conductive layer arranged on the first coating layer in the rigid portion; and a second coating layer arranged on the second conductive layer. A portion of the boundary of the first coating layer is aligned in the stepped portion.

    PRINTED CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE COMPRISING SAME

    公开(公告)号:US20220386465A1

    公开(公告)日:2022-12-01

    申请号:US17886327

    申请日:2022-08-11

    Abstract: Disclosed is a printed circuit board assembly comprising: a first printed circuit board; a second printed circuit board stacked with the first printed circuit board; and an interposer arranged between the first printed circuit board and the second printed circuit board, wherein the second printed circuit board includes a first part and a second part extending in a first direction from a part of the first part and wherein a length of the second part in a second direction perpendicular to the first direction is less than a length in the second direction of the first part, and wherein the direction of a first conductive pattern formed on the first part and the direction of a second conductive pattern formed on the second part are substantially perpendicular to each other.

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