The purpose of the present invention is to provide a thermal conductor achieving both excellent light weight and excellent rigidity and also having excellent heat dissipation property. In order to achieve the above object, the thermal conductor according to the present invention has the following configuration. That is, a thermal conductor in which a sheet-shaped thermal conductive material (II) having an in-plane thermal conductivity of 300 W/m·K or more is contained in a porous structure (I) configured of reinforcing fibers and a resin.