THERMAL CONDUCTOR AND MANUFACTURING METHOD THEREFOR

    公开(公告)号:US20220388204A1

    公开(公告)日:2022-12-08

    申请号:US17772593

    申请日:2020-11-11

    Abstract: The purpose of the present invention is to provide a thermal conductor achieving both excellent light weight and excellent rigidity and also having excellent heat dissipation property. In order to achieve the above object, the thermal conductor according to the present invention has the following configuration. That is, a thermal conductor in which a sheet-shaped thermal conductive material (II) having an in-plane thermal conductivity of 300 W/m·K or more is contained in a porous structure (I) configured of reinforcing fibers and a resin.

    SANDWICH STRUCTURE AND METHOD FOR MANUFACTURING SAME

    公开(公告)号:US20220404106A1

    公开(公告)日:2022-12-22

    申请号:US17772600

    申请日:2020-11-11

    Abstract: The purpose of the present invention is to provide a sandwich structure that has both excellent heat dissipation properties and excellent mechanical properties. In order to achieve this purpose, the sandwich structure of the present invention has the following structure. The sandwich structure includes a core member (I), and a fiber reinforced member (II) disposed on both sides of the core member (I), wherein the core member (I) includes a sheet-shaped heat conductive member (III) having an in-plane thermal conductivity of 300 W/m.K or more.

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