- 专利标题: NOVEL COMPOUND, THIN-FILM FORMING RAW MATERIAL THAT CONTAINS SAID COMPOUND, AND METHOD OF MANUFACTURING THIN FILM
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申请号: US17771181申请日: 2020-10-19
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公开(公告)号: US20220389570A1公开(公告)日: 2022-12-08
- 发明人: Atsushi SAKURAI , Masako HATASE , Masaki ENZU , Keisuke TAKEDA , Ryota FUKUSHIMA , Atsushi YAMASHITA
- 申请人: ADEKA CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: ADEKA CORPORATION
- 当前专利权人: ADEKA CORPORATION
- 当前专利权人地址: JP Tokyo
- 优先权: JP2019-199862 20191101
- 国际申请: PCT/JP2020/039239 WO 20201019
- 主分类号: C23C16/18
- IPC分类号: C23C16/18 ; C23C16/455
摘要:
Provided is a thin-film forming raw material containing a compound represented by the following formula (1): in the formula (1), R1 to R5 each independently represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a group containing a fluorine atom, M represents a metal atom, and “n” represents a valence of the metal atom represented by M, provided that at least one of R2, R3, and R4 represents the group containing a fluorine atom.
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