ETCHING METHOD
    1.
    发明公开
    ETCHING METHOD 审中-公开

    公开(公告)号:US20240030037A1

    公开(公告)日:2024-01-25

    申请号:US18023158

    申请日:2021-08-23

    申请人: ADEKA CORPORATION

    IPC分类号: H01L21/311

    CPC分类号: H01L21/31122

    摘要: Provided is a method of etching a metal oxide film in a laminate including a substrate and the metal oxide film formed on a surface thereof by an atomic layer etching method, the method including: a first step of introducing, into a treatment atmosphere storing the laminate, at least one oxidizable compound selected from the group consisting of: an alcohol compound; an aldehyde compound; and an ester compound; and a second step of introducing an oxidizing gas into the treatment atmosphere after the first step.

    METHOD FOR PRODUCING YTTRIUM OXIDE-CONTAINING FILM

    公开(公告)号:US20220364226A1

    公开(公告)日:2022-11-17

    申请号:US17765658

    申请日:2020-09-24

    申请人: ADEKA CORPORATION

    IPC分类号: C23C16/40

    摘要: The present invention provides a method for producing an yttrium oxide-containing film by an atomic layer deposition method, including: a step (A) of introducing a raw material gas obtained by vaporizing a thin film-forming raw material containing tris(sec-butylcyclopentadienyl)yttrium into a processing atmosphere to deposit the tris(sec-butylcyclopentadienyl)yttrium on a substrate; and a step (B) of reacting the tris(sec-butylcyclopentadienyl)yttrium deposited on the substrate with a reactive gas containing a gas selected from the group consisting of oxygen plasma, ozone, ozone plasma, and mixtures thereof in the processing atmosphere to oxidize yttrium.