Invention Application
- Patent Title: METHOD FOR INHIBITING TIN WHISKER GROWTH
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Application No.: US17363205Application Date: 2021-06-30
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Publication No.: US20230002924A1Publication Date: 2023-01-05
- Inventor: Paolo CREMA
- Applicant: STMicroelectronics S.r.l.
- Applicant Address: IT Agrate Brianza (MB)
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza (MB)
- Main IPC: C25D3/38
- IPC: C25D3/38 ; C22C9/02
Abstract:
A uniform copper-tin compound layer is electrochemically deposited on a surface of a copper-based base structure. A tin-based film is then formed on the copper-tin compound layer. The uniform copper-tin compound layer provides a barrier that effectively inhibits tin whisker growth.
Information query
