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    METHOD AND APPARATUS FOR MANUFACTURING LEAD FRAMES
    3.
    发明申请
    METHOD AND APPARATUS FOR MANUFACTURING LEAD FRAMES 有权
    制造引线框架的方法和装置

    公开(公告)号：US20140065296A1

    公开(公告)日：2014-03-06

    申请号：US14079457

    申请日：2013-11-13

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： Paolo CREMA

    IPC: H01L23/00

    CPC classification number: H01L24/43 ,  H01L21/4821 ,  H01L2224/43 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

    Abstract: An embodiment of a method and an apparatus for manufacturing lead frames are described. For example, a coating layer is formed on one or more predefined portions of the surface of the substrate of the lead frame by delimiting the predefined portions by means of screen printing. The employment of screen printing may allow obtaining large amounts of lead frames with excellent electronic and structural properties in a quick and cost-effective way.

    Abstract translation: 描述用于制造引线框架的方法和装置的实施例。 例如，通过丝网印刷限定预定部分，在引线框架的基板的表面的一个或多个预定部分上形成涂层。 使用丝网印刷可以以快速和成本有效的方式获得具有优异电子和结构特性的大量引线框架。

    PALLADIUM PLATING CATALYST LAYER BY LASER INDUCED FORWARD TRANSFER
    4.
    发明公开
    PALLADIUM PLATING CATALYST LAYER BY LASER INDUCED FORWARD TRANSFER 审中-公开

    公开(公告)号：US20240179847A1

    公开(公告)日：2024-05-30

    申请号：US18060481

    申请日：2022-11-30

    Applicant: STMICROELECTRONICS S.r.l.

    Inventor： Paolo CREMA

    IPC: H05K3/10 ,  C23F17/00 ,  C25D5/54 ,  H05K3/18

    CPC classification number: H05K3/107 ,  C23F17/00 ,  C25D5/54 ,  H05K3/181 ,  H01L21/4857

    Abstract: The present disclosure is directed to a method of forming a conductive trace in a substrate. A pattern of the trace is formed in the substrate by a laser machining technique. The pattern of the trace is covered by palladium colloid. The palladium colloid is transferred to the patterned substrate by a laser-induced forward transfer (LIFT) technique. The palladium colloid is converted to a palladium plating catalyst layer by a palladium acceleration process. The palladium plating catalyst layer provides a sufficient catalyst to grow a metal seeding layer by an electroless copper deposition technique. In addition, the palladium plating catalyst layer includes portions of tin material which increases adhesion of the metal seeding layer into the substrate. After growing the metal seeding layer, the pattern of the trace is filled by a copper layer through an electrochemical deposition technique.

    METHOD OF PROCESSING ARTICLES AND CORRESPONDING APPARATUS
    5.
    发明公开
    METHOD OF PROCESSING ARTICLES AND CORRESPONDING APPARATUS 审中-公开

    公开(公告)号：US20240141543A1

    公开(公告)日：2024-05-02

    申请号：US18496643

    申请日：2023-10-27

    Applicant: STMICROELECTRONICS S.r.l.

    Inventor： Paolo CREMA

    IPC: C25D21/04 ,  C25D7/12 ,  C25D17/00

    CPC classification number: C25D21/04 ,  C25D7/12 ,  C25D17/001 ,  C25D17/002

    Abstract: Articles such as substrates for semiconductor products comprising metal and resin portions with adhesion promoter material are processed in a plating bath, wherein the adhesion promoter material is exposed to dissolution as a result of prolonged exposure to the plating bath. The articles are processed by dipping them in the processing bath so that they have opposed surfaces exposed to the processing bath.
    The movement of the articles through the processing bath B may occur to be halted. In that case a gas flow is provided lapping the opposed surfaces of the articles to shield the opposed surfaces of the articles from exposure to the processing bath.

    LEAD FRAME SURFACE FINISHING
    6.
    发明申请
    LEAD FRAME SURFACE FINISHING 有权

    公开(公告)号：US20210375787A1

    公开(公告)日：2021-12-02

    申请号：US17322712

    申请日：2021-05-17

    Applicant: STMICROELECTRONICS S.R.L. ,  STMICROELECTRONICS INTERNATIONAL N.V.

    Inventor： Paolo CREMA ,  Jürgen BARTHELMES ,  Din-Ghee NEOH

    IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  C25D5/48 ,  H01L21/48 ,  C25D3/38 ,  C25D5/00 ,  C25D5/10

    Abstract: The present disclosure is directed to a lead frame design that includes a copper alloy base material coated with an electroplated copper layer, a precious metal, and an adhesion promotion compound. The layers compensate for scratches or surface irregularities in the base material while promoting adhesion from the lead frame to the conductive connectors, and to the encapsulant by coupling them to different layers of a multilayer coating on the lead frame. The first layer of the multilayer coating is a soft electroplated copper to smooth the surface of the base material. The second layer of the multilayer coating is a thin precious metal to facilitate a mechanical coupling between leads of the lead frame and conductive connectors. The third layer of the multilayer coating is the adhesion promotion compound for facilitating a mechanical coupling to an encapsulant around the lead frame.

    LEADFRAME PACKAGE USING SELECTIVELY PRE-PLATED LEADFRAME
    7.
    发明申请
    LEADFRAME PACKAGE USING SELECTIVELY PRE-PLATED LEADFRAME 审中-公开

    公开(公告)号：US20200373230A1

    公开(公告)日：2020-11-26

    申请号：US16990645

    申请日：2020-08-11

    Applicant: STMICROELECTRONICS S.r.l.

    Inventor： Paolo CREMA

    IPC: H01L23/495 ,  H01L23/00 ,  H01L21/48

    Abstract: The present disclosure is directed to a leadframe package with a surface mounted semiconductor die coupled to leads of the leadframe package through wire bonding. The leads are partially exposed outside the package and configured to couple to another structure, like a printed circuit board (PCB). The exposed portions, namely outer segments, of the leads include a plating or coating layer of a material that enhances the solder wettability of the leads to the PCB through solder bonding. The enclosed portions, namely inner segments, of the leads do not include the plating layer of the outer segment and, thus, include a different surface material or surface finish.

    METHOD OF MANUFACTURING MULTI-DIE SEMICONDUCTOR DEVICES AND CORRESPONDING MULTI-DIE SEMICONDUCTOR DEVICE
    8.
    发明申请
    METHOD OF MANUFACTURING MULTI-DIE SEMICONDUCTOR DEVICES AND CORRESPONDING MULTI-DIE SEMICONDUCTOR DEVICE 有权

    公开(公告)号：US20220199426A1

    公开(公告)日：2022-06-23

    申请号：US17549280

    申请日：2021-12-13

    Applicant: STMicroelectronics S.r.l.

    Inventor： Paolo CREMA

    IPC: H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H01L21/56

    Abstract: In a method of manufacturing a multi-die semiconductor device, a metal leadframe includes a die pad and electrically-conductive leads arranged around the die pad. First and second semiconductor dice are arranged on the die pad. A laser-activatable material is disposed on the dice and leads, and a set of laser-activated lines is patterned, including a first subset coupling selected bonding pads of the dice to selected leads, a second subset coupling selected bonding pads amongst themselves, and a third subset coupling the lines in the second subset to at least one line in the first subset. A first metallic layer is deposited onto the laser-activated lines to provide first, second and third subsets of electrically-conductive lines. A second metallic layer is selectively deposited onto the first and second subsets by electroplating to provide first and second subsets of electrically-conductive tracks. The electrically-conductive lines in the third subset are selectively removed.

    SCINTILLATOR RADIATION DETECTOR AND CORRESPONDING DOSIMETER
    9.
    发明申请
    SCINTILLATOR RADIATION DETECTOR AND CORRESPONDING DOSIMETER 有权

    公开(公告)号：US20210003721A1

    公开(公告)日：2021-01-07

    申请号：US16917517

    申请日：2020-06-30

    Applicant: STMICROELECTRONICS S.r.l.

    Inventor： Sara LOI ,  Paolo CREMA ,  Alessandro FREGUGLIA

    IPC: G01T1/20 ,  G01T1/02

    Abstract: A device such as a dosimeter for detecting ionizing radiation, for example, X-ray radiation, in hospitals or the like. The device includes scintillator material configured to produce light as a result of radiation interacting with the scintillator material, and photoelectric conversion circuitry optically coupled to the scintillator material and configured to produce electrical signals via photoelectric conversion of light produced by the scintillator material. The device includes a plurality of photoelectric converters optically coupled with the scintillator material at spatially separated locations. The plurality of photoelectric converters thus produce respective electrical signals by photoelectric conversion of light produced by the scintillator material as a result of radiation interacting with the scintillator material. Improved energy linearity is thus facilitated while providing more efficient detection over the whole energy spectrum of radiation detected.

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