Invention Application
- Patent Title: GENERATING 3D PRINTING POINTS
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Application No.: US17756778Application Date: 2020-01-06
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Publication No.: US20230005221A1Publication Date: 2023-01-05
- Inventor: Silvio B Melo , Luiz G.R. Charamba , Diogo B Henriques , Scott A White
- Applicant: Hewlett-Packard Development Company, L.P. , Universidade Federal de Pernambuco
- Applicant Address: US TX Spring; BR Recife
- Assignee: Hewlett-Packard Development Company, L.P.,Universidade Federal de Pernambuco
- Current Assignee: Hewlett-Packard Development Company, L.P.,Universidade Federal de Pernambuco
- Current Assignee Address: US TX Spring; BR Recife
- International Application: PCT/US2020/012422 WO 20200106
- Main IPC: G06T17/30
- IPC: G06T17/30 ; G06T17/20 ; B29C64/393 ; B33Y50/02

Abstract:
A method for generating 3D printing points may include obtaining a Steiner patch that is part of a tessellation approximation of the 3D object, determining a parametric curve of a slicing plane and the Steiner patch, determining a classification of the parametric curve, sampling, based upon the classification, first and second points spaced by a parametric spacing along the parametric curve, determining a Euclidean spacing of the first and second points, and comparing the Euclidean spacing to a predefined spacing threshold. In response to the Euclidean spacing failing to satisfy the predefined threshold, sampling a third point along the parametric curve between the first and second points, generating 3D printing points in Euclidean space for the object based upon the first point, second point and third point sampled along the parametric curve.
Information query