- 专利标题: SEMICONDUCTOR STRUCTURES AND METHODS OF MANUFACTURING THE SAME
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申请号: US17781357申请日: 2020-06-11
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公开(公告)号: US20230006091A1公开(公告)日: 2023-01-05
- 发明人: Dandan Zhu , Liyang Zhang , Kai Cheng
- 申请人: ENKRIS SEMICONDUCTOR, INC.
- 申请人地址: CN Suzhou, Jiangsu
- 专利权人: ENKRIS SEMICONDUCTOR, INC.
- 当前专利权人: ENKRIS SEMICONDUCTOR, INC.
- 当前专利权人地址: CN Suzhou, Jiangsu
- 国际申请: PCT/CN2020/095668 WO 20200611
- 主分类号: H01L33/02
- IPC分类号: H01L33/02 ; H01L33/14 ; H01L33/44 ; H01L33/00
摘要:
This application provides semiconductor structures and methods of manufacturing the same. A semiconductor structure includes: an N-type semiconductor layer, a light emitting layer, and a P-type ion doped layer that are disposed from bottom to up, wherein the P-type ion doped layer comprises an activated region and non-activated regions located on two sides of the activated region, P-type doping ions in the activated region are activated, and P-type doping ions in the non-activated region are passivated. The layout of the activated region and the non-activated regions makes an LED include: a high-efficiency light emitting region and light emitting obstacle regions located on two sides of the high-efficiency light emitting region.
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