An electronic device including a heat transfer member is provided. The electronic device includes a display including a first area and a second area, a first housing configured to support the first area and to form a first space, a second housing configured to support the second area and to form a second space, a hinge structure configured to foldably connect the first housing and the second housing based on a folding shaft to be in a first state in which the first and second areas form substantially a same plane or in a second state in which the first and second areas face each other, and a heat transfer member provided to extend from the first space to the second space through the hinge structure and configured to perform a heat transfer between the first space and the second space. The heat transfer member may include a first heat transfer area provided in the first space, a second heat transfer area provided in the second space, and a connecting area configured to connect the first heat transfer area and the second heat transfer area and provided to the hinge structure, and the heat transfer member may include a heat transfer space internally formed for communication from the first heat transfer area to the second heat transfer area through the connecting area, and a cover configured to surround the heat transfer pace and to form an appearance.