- 专利标题: HEAT CONDUCTION STRUCTURE WITH LIQUID-GAS SPLIT MECHANISM
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申请号: US17503262申请日: 2021-10-15
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公开(公告)号: US20230012170A1公开(公告)日: 2023-01-12
- 发明人: Chun-Hung LIN , Han-Lin CHEN
- 申请人: TAIWAN MICROLOOPS CORP.
- 申请人地址: TW New Taipei City
- 专利权人: TAIWAN MICROLOOPS CORP.
- 当前专利权人: TAIWAN MICROLOOPS CORP.
- 当前专利权人地址: TW New Taipei City
- 优先权: TW110124982 20210707
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
A heat conduction structure includes a shell, a wick structure, a separating sheet, and a working fluid. The shell includes a chamber. The chamber is divided into an evaporation room, a condensation room and a connection room formed between the evaporation room and the condensation room. The wick structure covers an inner bottom wall of the chamber. The separating sheet is received in the connection room and stacked on the wick structure. An airflow channel is formed between the separating sheet and the inner top wall of the connection room. The working fluid is disposed in the chamber. Therefore, the liquid working fluid and the gaseous working fluid are split by the separating sheet to increase the heat dissipating efficiency of the heat conduction structure.
公开/授权文献
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