Liquid immersion cooler
    1.
    发明授权

    公开(公告)号:US12114464B2

    公开(公告)日:2024-10-08

    申请号:US17725169

    申请日:2022-04-20

    发明人: Chun-Teng Chiu

    IPC分类号: H02H3/00 H05K7/20

    CPC分类号: H05K7/20236 H05K7/20263

    摘要: A liquid immersion cooler includes a metal case, a soldering layer, a heat conduction layer, and a porous structure. The metal case has a heated surface and a cooling surface disposed on back of the heated surface. The soldering layer is laid on the cooling surface. The heat conduction layer is laid on the soldering layer. The porous structure is laid on the heat conduction layer. Therefore, the waste heat from an electronic heat source may be rapidly dissipated.

    VAPOR CHAMBER AND SINGLE-PIECE SUPPORT STRUCTURE THEREOF

    公开(公告)号:US20240280329A1

    公开(公告)日:2024-08-22

    申请号:US18130430

    申请日:2023-04-04

    发明人: Chun-Hung LIN

    IPC分类号: F28D15/02

    CPC分类号: F28D15/0266 F28D15/0275

    摘要: A vapor chamber includes a shell body, a wick structure, a single-piece support structure and a working fluid. The shell body includes a first shell and a second shell. A chamber is formed between the first shell and the second shell. The wick structure is disposed in the chamber and attached on the shell body. The single-piece support structure is disposed in the chamber and between the first shell and the second shell, and includes support bodies and ribs. Each support body includes a hollow rod and an annular seat. Any adjacent two of the annular seats are connected by one of the ribs. The support body are arranged at an interval. The ribs are arranged along the support bodies to form hollow portions between each support body and each rib. The working fluid is disposed in the chamber.

    VAPOR CHAMBER AND SUPPORTING COLUMN SECUREMENT STRUCTURE THEREOF

    公开(公告)号:US20240060724A1

    公开(公告)日:2024-02-22

    申请号:US18207034

    申请日:2023-06-07

    发明人: Chun-Hung LIN

    IPC分类号: F28D15/04

    CPC分类号: F28D15/04

    摘要: The present disclosure discloses a vapor chamber and a supporting column securement structure thereof. The vapor chamber includes a housing and a supporting column securement structure. The housing includes a chamber. The supporting column securement structure includes a supporting mesh and a plurality of supporting columns. The supporting mesh is arranged inside the chamber and includes a plate with a plurality of mesh holes, and the plate includes a plurality of through holes formed thereon. The outer perimeter of the supporting column includes at least one positioning portion. Each supporting column penetrates through each through hole and is press-fitted at each one of the through holes via the positioning portion to be positioned on the supporting mesh. Accordingly, the supporting columns are precisely secured at the predefined locations, and the yield rate of the vapor chamber is increased.

    VAPOR CHAMBER AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20230345670A1

    公开(公告)日:2023-10-26

    申请号:US17891112

    申请日:2022-08-18

    发明人: Chun-Hung LIN

    IPC分类号: H05K7/20 F28D15/04

    CPC分类号: H05K7/2029 F28D15/04

    摘要: A vapor chamber and a manufacturing method thereof are disclosed. The vapor chamber includes a first housing, multiple supporting columns, a capillary structure, a second housing, a bonding layer, and a working fluid. The first housing includes an inner surface. Each supporting column is disposed on the inner surface of the first housing and includes an end surface. The capillary structure is disposed on the inner surface of the first housing. The second housing is sealed with the first housing correspondingly to jointly define a chamber. The bonding layer is formed between the inner surface of the first housing and the end surfaces of the supporting columns. The working fluid is arranged inside the chamber. Accordingly, it is able to swiftly changing the positions of the supporting columns according to the actual cooling needs, thereby significantly reducing the manufacturing time required.

    HEAT CONDUCTION STRUCTURE WITH LIQUID-GAS SPLIT MECHANISM

    公开(公告)号:US20230012170A1

    公开(公告)日:2023-01-12

    申请号:US17503262

    申请日:2021-10-15

    IPC分类号: H05K7/20

    摘要: A heat conduction structure includes a shell, a wick structure, a separating sheet, and a working fluid. The shell includes a chamber. The chamber is divided into an evaporation room, a condensation room and a connection room formed between the evaporation room and the condensation room. The wick structure covers an inner bottom wall of the chamber. The separating sheet is received in the connection room and stacked on the wick structure. An airflow channel is formed between the separating sheet and the inner top wall of the connection room. The working fluid is disposed in the chamber. Therefore, the liquid working fluid and the gaseous working fluid are split by the separating sheet to increase the heat dissipating efficiency of the heat conduction structure.

    HEAT DISSIPATION MODULE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20220364798A1

    公开(公告)日:2022-11-17

    申请号:US17322359

    申请日:2021-05-17

    发明人: Chun-Hung LIN

    摘要: The disclosure relates to a heat dissipation module and a manufacturing method thereof. The heat dissipation module includes a heat pipe, multiple heat dissipation fins and multiple rings. The heat pipe has a peripheral wall. Each heat dissipation fin has a through hole and an annular wall disposed on an outer edge of the through hole. The heat dissipation fins are adapted to sheathe the heat pipe in a spacedly stacked manner through the through hole. Each ring annularly is adapted to sheathe each annular wall in a compressive manner to embed and compressedly connect each annular wall to the peripheral wall. Therefore, efficiency of heat dissipation and structural strength of the heat dissipation structure are improved.

    WATER-COOLED DISTRIBUTIVE HEAT DISSIPATION SYSTEM FOR RACK

    公开(公告)号:US20200253088A1

    公开(公告)日:2020-08-06

    申请号:US16655184

    申请日:2019-10-16

    IPC分类号: H05K7/20

    摘要: A water-cooled pressurized distributive heat dissipation system includes a water tank having a distributing duct, branch modules separately corresponding to the servers and a converging duct. Each branch module has a branch pipe inserted into a corresponding one of the servers and a water block connecting to the branch pipe. An end of each of the branch pipe connects to the distributing duct in order. The converging duct connects to another end of each branch pipe in order. A working fluid is accommodated in the water tank and driven by a pump to flow toward the distributing duct to the branch modules and the converging duct. A flow direction of the working fluid in the distributing duct is the same as a flow direction of the working fluid in the converging duct.

    HEAT DISSIPATING DEVICE
    8.
    发明申请

    公开(公告)号:US20200232714A1

    公开(公告)日:2020-07-23

    申请号:US16255672

    申请日:2019-01-23

    发明人: Chun-Hung LIN

    IPC分类号: F28D15/02 F28D15/04 F28F3/12

    摘要: A heat dissipating device includes an extruded heat sink and a fan, and the extruded heat sink includes a base, a multiple of cooling fins extending outwardly from the periphery of the base, a vacuum chamber formed directly in the base, and a capillary tissue disposed in the vacuum chamber and filled with a working fluid. The fan is mounted onto the extruded heat sink. Therefore, the heat conduction and dissipation rate of the extruded heat sink can be increased to improve the overall heat dissipation performance.

    WATER PUMP HAVING DIRECTION ADJUSTING MECHANISM

    公开(公告)号:US20200032814A1

    公开(公告)日:2020-01-30

    申请号:US16047758

    申请日:2018-07-27

    IPC分类号: F04D29/46 F04D29/44 F04D29/62

    摘要: A water pump having direction adjusting mechanism includes: a first housing, formed with an accommodation space and including a first pipe member and a plurality of first fasten parts arranged at a periphery of the first housing; a stator set, including a base plate covered on the first housing, and a coil structure; a partition cover enclosing the coil structure; an impeller set disposed on the partition cover; a rotor set disposed corresponding to the coil structure; and a second housing, engaged at another side of the first housing corresponding to the base plate, and including a second pipe member and a plurality of second fasten parts disposed corresponding to the first fasten parts and arranged at a periphery of the second housing, thereby allowing relative locations of the first pipe member and the second pipe member to be adjusted.

    Vapor chamber structure
    10.
    发明授权

    公开(公告)号:US10018427B2

    公开(公告)日:2018-07-10

    申请号:US15260184

    申请日:2016-09-08

    发明人: Chun-Hung Lin

    IPC分类号: F28F7/00 F28D15/04 H05K7/20

    摘要: A vapor chamber structure includes an upper metal casing, a lower metal casing, a partition plate and a working fluid. The lower metal casing is engaged and sealed with the upper metal casing, and a containing chamber is formed between the upper metal casing and the lower metal casing. The partition plate is laid inside the containing chamber and includes a gas channel configured to be facing the upper metal casing. The working fluid is filled in the containing chamber. Therefore, the gas evaporated in the vapor chamber will move along a fixed path to prevent the occurrence of turbulence effectively.