Invention Publication
- Patent Title: HEAD, HEAD MODULE, AND APPARATUS THAT DISCHARGES LIQUID
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Application No.: US17972880Application Date: 2022-10-25
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Publication No.: US20230141751A1Publication Date: 2023-05-11
- Inventor: Yuu SUGIOKA , Toshiaki MASUDA , Kentaroh YAMANAKA , Hitoshi USAMI
- Applicant: Yuu SUGIOKA , Toshiaki MASUDA , Kentaroh YAMANAKA , Hitoshi USAMI
- Applicant Address: JP Kanagawa
- Assignee: Yuu SUGIOKA,Toshiaki MASUDA,Kentaroh YAMANAKA,Hitoshi USAMI
- Current Assignee: Yuu SUGIOKA,Toshiaki MASUDA,Kentaroh YAMANAKA,Hitoshi USAMI
- Current Assignee Address: JP Kanagawa
- Priority: JP 21183763 2021.11.10
- Main IPC: B41J2/14
- IPC: B41J2/14
Abstract:
A head includes: a silicon substrate; an insulating film on the silicon substrate; an electrode wiring on the insulating film; a flexible wiring connected to the electrode wiring; and a conductive film electrically connects the flexible wiring and the electrode wiring in a bonding area. The silicon substrate has an exposed area on a surface of the silicon substrate facing the insulating film, and the exposed area is in a vicinity of the bonding area and is exposed from the insulating film.
Public/Granted literature
- US12202265B2 Head, head module, and apparatus that discharges liquid Public/Granted day:2025-01-21
Information query
IPC分类:
