公开(公告)号：US20230141751A1

公开(公告)日：2023-05-11

申请号：US17972880

申请日：2022-10-25

申请人： Yuu SUGIOKA ,  Toshiaki MASUDA ,  Kentaroh YAMANAKA ,  Hitoshi USAMI

发明人： Yuu SUGIOKA ,  Toshiaki MASUDA ,  Kentaroh YAMANAKA ,  Hitoshi USAMI

IPC分类号： B41J2/14

CPC分类号： B41J2/14201 ,  B41J2002/14491

摘要： A head includes: a silicon substrate; an insulating film on the silicon substrate; an electrode wiring on the insulating film; a flexible wiring connected to the electrode wiring; and a conductive film electrically connects the flexible wiring and the electrode wiring in a bonding area. The silicon substrate has an exposed area on a surface of the silicon substrate facing the insulating film, and the exposed area is in a vicinity of the bonding area and is exposed from the insulating film.

公开(公告)号：US20220396071A1

公开(公告)日：2022-12-15

申请号：US17831661

申请日：2022-06-03

申请人： Kentaroh Yamanaka

发明人： Kentaroh Yamanaka

IPC分类号： B41J2/045

摘要： A head unit includes a liquid discharge head, circuitry, and a cable. The liquid discharge head includes multiple piezoelectric elements including multiple individual electrodes and a common electrode. The circuitry generates a first drive signal applied to the multiple individual electrodes, a second drive signal applied to the multiple individual electrodes and having a different waveform from the first drive signal, and a voltage signal applied to the common electrode. The cable connects the liquid discharge head and the circuitry. The cable includes n first wires through which the first drive signal is transmitted, n second wires through which the second drive signal is transmitted, and n third wires through which the voltage signal is transmitted. Here, n is an integer equal to or greater than 2. Each of at least (n−1) third wires is arranged between one of the n first wires and one of the n second wires.