Invention Publication
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
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Application No.: US17920484Application Date: 2021-02-08
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Publication No.: US20230142877A1Publication Date: 2023-05-11
- Inventor: Haruka SHIMIZU , Hiromi SHIMAZU
- Applicant: HITACHI, LTD.
- Applicant Address: JP Chiyoda-ku, Tokyo
- Assignee: HITACHI, LTD.
- Current Assignee: HITACHI, LTD.
- Current Assignee Address: JP Chiyoda-ku, Tokyo
- Priority: JP 20084886 2020.05.14
- International Application: PCT/JP2021/004652 2021.02.08
- Date entered country: 2022-10-21
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L25/07 ; H01L23/367 ; H01L29/16 ; H01L29/06 ; H01L21/683 ; H01L21/78

Abstract:
An accelerated test for applying a high voltage is performed without reducing a manufacturing yield of a semiconductor device using a wide gap semiconductor material. The technical idea in the embodiment is, for example, an idea of performing the accelerated test in the state of a semiconductor wafer to distinguish a latent defect as illustrated in FIG. 4. That is, the technical idea in the embodiment is to perform the accelerated test on a semiconductor chip containing a wide bandgap semiconductor material as a main component not in the state of a semiconductor chip but in the state of the semiconductor wafer.
Information query
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